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精确定位，“稳如泰山”
测试头采用精密浮动机构，测试Arm的Y轴单独驱动，可快速精确之定位，避免组件损伤，达到稳定之高良率。
The testing head adopts a precision floating mechanism, and the Y-axis of the testing Arm is driven alone. It can quickly and accurately locate, avoid component damage and achieve stable high yield.
兼容性强，实惠省时
进料盘组件采用电机顶升结构，适应不同厚度规格料盘。tray移载机构兼容各种不同规格tray盘，针对各种IC封装MSOP / QFN / QFP / SIM / LGA / BGA / CSP，3X3mm到大材料55X55mm等。
The feed tray assembly adopts the motor lifting structure to adapt to the different thickness specifications of the feed tray. Tray transfer mechanism is compatible with various specifications of tray tray, MSOP / QFN / QFP / SIM / LGA / BGA / CSP, 3X3mm to 55X55mm for various IC packages.
小型设计，更省空间
全机采用模块化设计，达到小型，省空间之要求。
The whole machine adopts Modular design, to achieve small, space-saving requirements.
上下料手臂Y轴双驱，精度更高，晃动更小。
Upper and lower material arm Y-axis double drive, higher precision, less sway.
具备自动校高，自动计算测压力，socket叠料检测功能。
With automatic height, automatic calculation of pressure, socket stack detection function.
配备自动清洁组件，达到设定值后自动清理测试探针。
Equipped with an automatic cleaning component, the test probe is automatically cleaned after the set value is reached.
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